Share

Share on facebook
Share on whatsapp
Share on twitter
Share on email

KOCH-CHEMIE - FINE CUT F6.01

19,7456,35

Clear
SKU N/A Category

Description

FINE CUT F6.01

Fine Polishing Compound, Silicone-Oil-Free

FINE CUT F6.01 is an intelligent machine polish of the latest generation with unique aluminium oxide quality. The intelligent grain size ensures very quick, complete removal of wash system scratches and similar traces of use and gives the paintwork a long-lasting deep sheen. Sanding marks left behind by 2500 grade sanding media are removed effortlessly. FINE CUT F6.01 is therefore ideally suited for perfect reconditioning of medium to heavily weathered paintwork. Perfectly coordinated for the treatment of scratch-proof paint.

CUT: 6.0

GLOSS: 7.0

Areas Of Use

Paintwork on cars, commercial vehicles, motorcycles, etc.

Recommendations For Use

Apply the fine polishing compound to the polishing pad (Koch-Chemie FINE CUT (Yellow) Pad or lambswool pad) and polish the precleaned surface with max. 2.000 rpm crosswise. The cleaning effect can be varied by means of pressure, polishing medium and rpm. At the start of the polishing process we recommend working with greater pressure at a lower speed. In the further course, reduce the pressure and polish to a high gloss at a higher speed. The remaining polish residues can be removed easily with The Rag Company’s Edgeless 300 or Edgeless 365 microfiber cloth. Remove any streaks or traces of polish with Koch-Chemie MICRO CUT M3.02.

Warnings

Shake before using. Before using, check suitability and compatibility. Do not use on hot surfaces. Protect against frost and excessive heat.

Notice

This product information can advise you only without obligation. Liability on the part of Koch-Chemie cannot be derived. Please check whether the product is suitable for your application.

Additional information

WeightN/A
Brand

Koch-Chemie

Purpose

Exterior

Size

250ml, 1 Liter

Reviews

There are no reviews yet.

Be the first to review “KOCH-CHEMIE – FINE CUT F6.01”

Your email address will not be published. Required fields are marked *